Selective laser melting (SLM / LPBF) is the most widely used process for the additive manufacturing of metallic components.

Components are created layer by layer on a build platform in cycles consisting of powder application, selective melting by the laser beam and lowering of the build platform by a layer thickness.

In the meantime, metal printing has established itself in many industries and the number of pieces is increasing. Separating the support structure from the component and build platform must therefore be done quickly, efficiently and precisely.

Our saws are ideally suited for this!

The precision of the band saw enables the support structure to be cut off close to the component surface.

The remaining support material can be removed with the help of a cleaning cut. This reduces the amount of rework required on the workpiece and building platform. With our band saw, a wide variety of materials such as aluminium, titanium, stainless steel and tool steel can be removed from the building platform.